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tweaktown.com
Intel details its first hybrid CPU 'Lakefield' on 10nm tech
Intel's next-gen Lakefield CPU is on 10nm and is the first to use Foveros 3D design packaging.
Feb 27, 2019
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#Intel Lakefield Review
Over the next few days, I’ll be sharing a year-in-review featuring some of your favourite videos, photos, and stories from Discover Lakefield in 2025. Thank you so much for being here, engaging, sharing, and supporting the page throughout the year, it means the world. We’re kicking things off with one of the top videos of the year, posted in October 2025. So many great moments ahead, stay tuned! #lakefieldontario #smalltowncharm #ontariocanada #yearinreview | Discover Lakefield
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Intel has launched "Lakefield," Intel Core processors with Intel Hybrid Technology. Watch this toy build of a mock processor featuring Intel’s Foveros 3D packaging technology and hybrid CPU architecture. https://intel.ly/2CRuYrl | Intel
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