Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...

CEO Pat Gelsinger joins Syenta’s board as it raises $26M to commercialize AI chip advanced packaging tech—boost bandwidth, ...

Samsung is reportedly considering a $4 billion chip packaging and testing project in Vietnam, deepening the country’s role in ...

India's first advanced 3D glass chip packaging unit to be set up in Bhubaneswar with Rs 1,943 crore investment, boosting ...

Onto Innovation (NYSE:ONTO) stock just earned a strong endorsement from Stifel, which upgraded shares to Buy from Hold and raised its price target to $350 from $220. The catalyst isn’t a quarterly ...

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

Odisha poised to power PM Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing: Chief ...

Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of ...

India announces its first 3D semiconductor packaging unit in Odisha, boosting AI, 5G and defence manufacturing ambitions!

The facility set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar is worth ₹1,943 crore ...

The heterogeneous integration packaging solutions unit of 3D Glass Solutions marks a significant capability leap in advanced ...

Best Debt Free Blue Chip Stocks to Invest In. On April 15, 2026, Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...