JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...

SAIMEMORY—founded in December 2024, and officially launched in June 2025—is a joint venture between SoftBank, Intel, and the University of Tokyo.

Samsung has officially announced its new HBM4 memory is one of the first to be 'commercially' shipped, ready for 13Gbps and ...

GDDR7 is the state-of-the-art graphics memory solution with a performance roadmap of up to 48 Gigatransfers per second (GT/s) and memory throughput of 192 GB/s per GDDR7 memory device. The next ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash (HBF) ...