Nasdaq

Cadence Collaborates with GlobalFoundries to Advance Silicon Photonics IC Design

Cadence photonics solution optimized for GF Fotonix platform, ushering in a new era of silicon photonics products Comprehensive Cadence photonics solution enables customers to streamline monolithic ...
Nasdaq

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Semiconductor Engineering

Managing Complexity: Evolving Approaches To Design Rule Checking In Modern IC Design

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
TMCnet

MICROIP Validates Advanced ASIC Design and SW/HW Integration Capabilities with First-Pass Success of NFC IC

Technically, the industrial-grade chip supports ISO15693, ISO14443 Type A/B, and ISO18092 standards. It features Direct Mode ...
VentureBeat

TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.

Tower Semiconductor Partners with LightIC to Expand Silicon Photonics Beyond AI Infrastructure into Physical AI and Automotive

Leveraging Tower’s Mature Silicon Photonics Foundry Platform to Enable Scalable FMCW LiDAR. MIGDAL HAEMEK, Israel, and SAN JOSE, CA. – January 05, 2026 – Tower Semiconductor ...
Semiconductor Engineering

3D-IC Market Outlook: Technology Roadmaps, Readiness, And Design Implications

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
EDN

Signal integrity and power integrity analysis in 3D IC design

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...
EDN

Putting 3D IC to work for you

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Digi Times

Taiwan-based IC design houses struggle to catch up in silicon photonics as US firms lead

Although silicon photonics has become one of the most anticipated developments in the semiconductor industry, Taiwan-based IC design houses admittedly need more time to catch up with US-based ...
Digi Times

Malaysian IC design houses awaiting details of Arm deal

The Malaysian government recently announced a technology licensing agreement worth US$250 million with silicon intellectual property (IP) powerhouse Arm. The deal aims to assist the development of IC ...
Electronic Design

IC-Style Modules Shrink Silicon Footprint for Buck Regulators

International Rectifier's SupIRBuck family of point-of-load regulators co-package controllers and MOSFETs in compact QFN packages, reducing the silicon footprint required to implement single-output, ...